Wall Moisture Sensor - WSM1 v1.2.0

Main Render

Monitor wall moisture using capacitive sensors. The device supports two methods for reading capacitive values, allowing for comparison and experimentation.

GitHub link

Table of Contents

Render Top Angled

Render Top Angled

Render Top

Render Top

Render Bottom

Render Bottom

Schematic

Layout

Interactive BOM

IBOM HTML

BOM

BOM HTML

KiCad Revision Inspector (KiRI)

KiCad Revision Inspector (KiRI) is a tool for comparing different versions of KiCad projects. It exports project revisions to SVG format for visual comparison using an onion skin view. This helps identify changes and errors in PCB designs.

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Downloads

jlcpcb

3D Step

Reports

ERC Report

DRC Report

PCB

Board size: 78.5x99.34 mm (3.09x3.91 inches)

  • This is the size of the rectangle that contains the board
  • Thickness: 1.6 mm (63 mils)
  • Material: FR4
  • Finish: ENIG
  • Layers: 4
  • Copper thickness: 35 µm

Solder mask: TOP / BOTTOM

  • Color: Black

Silk screen: TOP / BOTTOM

  • Color: White

Stackup:

Name Type Color Thickness [µm] Material Er Loss tan
F.SilkS Top Silk Screen          
F.Paste Top Solder Paste          
F.Mask Top Solder Mask   10      
F.Cu copper   35      
dielectric 1 prepreg   100 FR4 4.5 0.020
In1.Cu copper   35      
dielectric 2 core   1240 FR4 4.5 0.020
In2.Cu copper   35      
dielectric 3 prepreg   100 FR4 4.5 0.020
B.Cu copper   35      
B.Mask Bottom Solder Mask   10      
B.Paste Bottom Solder Paste          
B.SilkS Bottom Silk Screen          

Important sizes

Clearance: 0.2 mm (8 mils)

Track width: 0.2 mm (8 mils)

  • By design rules: 0.1 mm (4 mils)

Drill: 0.4 mm (16 mils)

  • Vias: 0.4 mm (16 mils) [Design: 0.4 mm (16 mils)]
  • Pads: 1.1 mm (43 mils)
  • The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)

Via: 0.6/0.3 mm (24/12 mils)

  • By design rules: 0.25/0.3 mm (10/12 mils)
  • Micro via: yes [0.2/0.1 mm (8/4 mils)]
  • Buried/blind via: yes
  • Total: 139 (thru: 139 buried/blind: 0 micro: 0)

Outer Annular Ring: 0.1 mm (4 mils)

  • By design rules: 0.13 mm (5 mils)

Eurocircuits class: 8C

  • Using min drill 0.4 mm for an OAR of 0.1 mm

General stats

Components count: (SMD/THT)

  • Top: 43/2 (SMD + THT)
  • Bottom: 1/0 (SMD)

Defined tracks:

  • 0.2 mm (8 mils)
  • 0.4 mm (16 mils)
  • 0.8 mm (31 mils)

Used tracks:

  • 0.2 mm (8 mils) (459) defined: yes
  • 0.4 mm (16 mils) (77) defined: yes
  • 0.8 mm (31 mils) (1) defined: yes

Defined vias:

Used vias:

  • 0.6/0.3 mm (24/12 mils) (Count: 139, Aspect: 2.7 A) defined: no

Holes (excluding vias):

  • 1.0 mm (39 mils) (6)
  • 1.5 mm (59 mils) (6)
  • 2.2 mm (87 mils) (1)
  • 2.6 mm (102 mils) (1)

Oval holes:

Drill tools (including vias and computing adjusts and rounding):

  • 0.4 mm (16 mils) (139)
  • 1.1 mm (43 mils) (6)
  • 1.6 mm (63 mils) (6)
  • 2.2 mm (87 mils) (1)
  • 2.6 mm (102 mils) (1)

Solder paste stats:

Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³.

The stencil thickness is 0.12 mm.

Side Pads with paste Area [mm²] Paste [g]
Total 172 173.54 0.86

Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren’t computed.

Credits