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DRC report for wall_moisture-hardware
PCB: wall_moisture-hardware
Revision: 1.2.0
Date: 2025-07-30T14:43:51+0000
KiCad Version: 9.0.1
Errors: 0 (+7 excluded)
Warnings: 0 (+2 excluded)
Total: 0 (+9 excluded)

Violations

Type Description Details
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(114.975939 mm, 135.427778 mm): Pad 2 [GND] of U3 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(75.137439 mm, 123.990278 mm): Pad 1 [GND] of D3 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(73.080982 mm, 123.976214 mm): Pad 1 [GND] of D2 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(112.194728 mm, 132.702778 mm): Pad 2 [GND] of C11 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(104.375939 mm, 136.127778 mm): Pad 2 [GND] of U4 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(104.472803 mm, 125.152778 mm): Pad 2 [GND] of C10 on F.Cu
starved_thermal Thermal relief connection to zone incomplete (layer F.Cu; zone min spoke count 2; actual 1) @(56.238439 mm, 139.527778 mm): Zone [GND] on F.Cu
@(92.338439 mm, 131.165278 mm): Pad 2 [GND] of U7 on F.Cu
silk_over_copper Silkscreen clipped by solder mask @(96.7 mm, 80.1 mm): Arc on F.Silkscreen
silk_overlap Silkscreen overlap @(104.298439 mm, 115.267778 mm): Segment of SW1 on F.Silkscreen
@(96.7 mm, 80.1 mm): Arc on F.Silkscreen

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